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Making the Right Selection: A Comparative Analysis for the Treatment of Refractory Gold ConcentratesBy Rodney Clary
Building on work completed in earlier papers, the current paper presents a techno-economic evaluation of two recently demonstrated technologies for treatment of arsenic containing refractory gold conc
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Flowsheets Development for Recovery of Nonferrous Metal Values from Secondary Resources by Solvent ExtractionBy T. K. Mukherjee, C. K. Gupta
"The importance of the processing of secondary resources such as solid industrial wastes and liquid effluents as well as byroducts for the recovery of the associated metal values hardly needs any elab
Jan 1, 1996
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Metal Extraction With Supercritical FluidsBy C. M. Wai
Metal species in solid and liquid materials can be extracted by supercritical carbon dioxide containing a suitable ligand. This in situ chelation-supercritical fluid extraction technique offers, sever
Jan 1, 1996
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump MetallizationsBy Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003
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Model Studies of Drop Reactions with Gas EvolutionBy D. K. Panda
The behavior of single drops with gas evolution at the interface is of interest because this is one of the important reactions that occur in oxygen steelmaking vessels, where a large amount of iron-ca
Jan 1, 1994
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Electrical, Optical and Structural Properties of Vacuum Evaporated CdTe Thin FilmsBy Shadia J. Ikhmayies
Polycrystalline CdTe thin films were prepared by vacuum evaporation on glass substrates. The I-V plots which were linear were used to find the resistivity. A value of 2.10×106 .cm was obtained. The t
Jan 1, 2009
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump Metallizations (0810a053-7c7a-4a4b-be9d-246cf684a53d)By Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003
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Soil Washing Using Mineral Processing Plant in Hanaoka Mine, Dowa Mining Co., Ltd.By Masaru Tomoguchi, Tom Nishiyama, Naoto Sasamoto
"In Hanaoka Mine, which was one of the major ""black ore"" (Kuroko) mines in the north part of Japan, mining has finished in 1994, and only mineral processing plant is available now. Recently this min
Jan 1, 2000
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Electrocatalytic Reduction of CO2 to C2H4 at a Gas/Solution/Metal InterfaceBy Kotaro Ogura
"The electrolysis process in which CO2 is selectively reduced to C2H4 at a three-phase(gas/solution/metal) interface on a copper-mesh electrode has been developed in a concentrated solution of potassi
Jan 1, 2008
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Effects of Nickel and Cobalt on the Solubility of Nitrogen in AlloysBy W. Murray Small
Nickel plays an important role in determining the properties of many stainless steels and superalloys. Cobalt also contributes significantly to the performance of certain grades of superalloys. A majo
Jan 1, 1993
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The Behaviour Of Polonium-210 In The Processing Of Tin-Lead ResiduesBy A. M. Strachan
Capper Pass & Son Limited Was, until its recent closure, the world's largest producer of tin from secondary materials including solder drosses, non-ferrous smelter flue dusts, tin based metal all
Jan 1, 1992
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Direct Atmospheric Leaching of Saprolitic Nickel Laterite Ores with Sulphuric AcidBy Walter Curlook
An atmospheric acid leaching process for leaching nickel and cobalt from highly-serpentinized saprolitic fractions of nickel laterite deposits has been developed and patented [I]. The process involves
Jan 1, 2004
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Metallurgical Gas Cleaning Effluent Decontamination' And Acid RecoveryBy D. W. Lawler
Prior to the manufacture of sulphuric acid in metallurgical plants, the SO2 rich gas from the smelter, roaster, or furnace must be cleaned to removed particulates, volatile contaminants, SO3, and wate
Jan 1, 1998
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Green Chemistry Principles Applied to the Selective Separation and Purification of Specialty Metals Using Molecular Recognition TechnologyBy R. Steven Izatt
Green chemistry principles will be discussed, and examples will be given of the use of Molecular Recognition Technology (MRT) to selectively separate specialty metals such as cobalt, nickel, bismuth,
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Advances in Bromide Gold Leaching TechnologyBy A. Dadgar
The adsorption kinetics of AuBr4 on Dowex ® -21K ion-exchange resin were studied and found to be independent of the initial gold, bromine, and base metals concentrations. A commercially-available und
Jan 1, 1992
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Technological Improvements in Anode Furnace Operation At Saganoseki Smelter and RefineryBy S. Yabe
The reinforcement of the annual copper production capacity to 330,000 metric tons has been attained at Saganoseki Smelter & Refinery in 1991, which is one of the largest and most efficient custom smel
Jan 1, 1993
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The Aisi Program for Direct SteelmakingBy Egil Aukrust
"An American Iron and Steel Institute Task Force evaluated developing direct steelmaking technology worldwide to seek a replacement for the coke-oven, blast-furnace, basic-oxygen process technology no
Jan 1, 1988
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Thennal Plasma Treatment Of Metal And Material Wastes (Keynote)By Patrick R. Taylor
In the search for the development of more "environmentally friendly" and more intensive waste disposal approaches to meet more and more stringent environmental regulations, thermal plasma-based proces
Jan 1, 2003
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Thermal Plasma Treatment Of Metal And Material Wastes (Keynote)By Patrick R. Taylor
In the search for the development of more "environmentally friendly" and more intensive waste disposal approaches to meet more and more stringent environmental regulations, thermal plasma-based proces
Jan 1, 2003
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Characterization of Nanocrystalline SnO2:F Thin Films Prepared by the Spray Pyrolysis TechniqueBy Shadia J. Ikhmayies
"Nanocrystalline fluorine-doped tin oxide, SnO2:F, thin films were prepared by the spray pyrolysis (SP) technique on glass substrates. The films were characterized by X-ray diffraction (XRD), scanning
Jan 1, 2012