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Recovery of Copper and 1, Hydroxyethane-1, 1-Diphosphonic Acid (Hedp) From Cyanide-Free Electroplating Wastewater by ElectrodialysisBy Denise Crocce Romano Espinosa, Andrea Moura Bemardes, Jorge Alberto Soares Tenorio, Daniella Cardoso Buzzi, Tatiana Scarazzato
"In copper plating processes, a fraction of raw materials are incorporated to the final products, while other portions are discarded as effluents. In this study, the application of electrodialysis (a
Jan 1, 2014
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Applications Of Biotechnology In The Recovery Of GoldBy Yosry Attia
Recent emphasis on environmental effects and costs of conventional mining processing, plus success in accelerating bacterial action, suggest that biotechnology be explored for gold ore processing.
Jan 1, 1985
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Thermodynamic Analysis On The Chloridization Reaction In Dust Recycling ProcessesBy Shu Yamaguchi
The behavior of halide impurities in pyrometallurgical processes such as Wealtz kiln and MF process has been discussed based on the thermochemical data and the reported data of PbO activity in PbCl2-P
Jan 1, 2003
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Reduction Kinetics of Iron Oxide in CaO-SiO2-Al2O3-FexO-C MixturesBy Yuanyuan Zhang, Patrick J. Masset
"The reduction of FexO in slag is one of the fundamental reactions in iron and steelmaking technology, including the blast furnace process (BF). Experiments on the reduction reaction of iron oxide usi
Jan 1, 2011
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Buried Proterozoic Terranes in the Midcontinent: for Geologic ExplorationBy Eva B. Kisvarsanyi
An Early Proterozoic orogenic terrane of metasedimentary and metaigneous rocks underlies Nebraska, Kansas, and Missouri. Middle Proterozoic epizonal terranes of anorogenic granite and rhyolite, a know
Jan 1, 1987
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Indium Recovery from Discarded Light Emitting Diode (LED) Liquid Crystal Display (LCD) TV: Influence of Leaching ReagentsBy Priscilla Aki Mori de Hanashiro, Viviane Tavares de Moraes, Denise Crocce Romano Espinosa, Hugo Hashimoto
"The LCDs are used in televisions, calculators, mobile phones, computers (laptops and tablets), video games and other electronic devices. The advancements in technology make obsolete these devices, ca
Jan 1, 2014
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Thermodynamic Conditions for the Formation of Dioxin during the Recycling of Non Ferrous Metals from Electric and Electronic ScrapBy Nourreddine Menad
Plastic materials have been associated with electric and electronic applications since the early days of the electrical industry. Plastics can amount to 30 percents of the scrap mass. Generally, they
Jan 1, 1998
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In Situ Micro Raman Study of the NO3 − Electrochemical Behavior in Molten NaNO3–KNO3 MixturesBy Zhuo Sheng
We have designed a high-temperature Raman micro-furnace and cell that is suited for the electrochemical process study of the NO3 − in molten NaNO3– KNO3 (fraction of NaNO3 50 wt%) salt. During the cyc
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Kinetics of Copper Concentrate Oxidation in Fluidized Bed ReactorBy Milorad Cirkovic
Kinetics of copper concentrate oxidation in roasting processes in a fluidized bed reactor has been studied at temperatures between 600°C and 720°C using particles of 0.038 to 2.5 mm in average size. T
Jan 1, 1999
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Toward Mercury Management on U.S. Department of Energy Sites: Development and Selection TechnologiesBy Michael I. Morris
The U.S. Department of Energy's (DOE's) Transuranic and Mixed Waste Focus Area (TMFA), funded from fiscal year (FY) 1996 though FY 2002, was tasked with finding solutions for the mixed waste
Jan 1, 2003
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Gold Recovery from Thiourea Solutions by Direct ElectrowinningBy C. Dupuis
Thiourea is a promising reagent for gold extraction especially from refractory ores that cannot be treated by traditional cyanidation route. In this study recovery of gold from thiourea leaching solut
Jan 1, 1989
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Electrochemical Aspects of Electro winning Lead Metal From Brine-Lead Chloride Electrolytes in the Temperature Range 55-80°CBy Xiangwen Wang
Electrochemical measurements associated with the electrowinning of lead metal from concentrated brine (NaCI) - lead chloride (PbCI,) electrolytes at temperatures in the range 328 to 353°K (55 - 80°C)
Jan 1, 1993
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Electrically Enhanced Metal Purification Using SlagBy Geoffrey A. Brooks, M Akbar Rhamdhani, Md Saiful Islam
A novel electrically-enhanced metal purification using slag has been developed. This was achieved by applying DC potential between liquid metal and slag phases. The concept was demonstrated through sm
Jan 1, 2014
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Aqueous Precipitation:. Population Balance Modeling And Control In Multi-Cation SystemsBy James A. Voigt
The efficient separation of metal species from aqueous streams by precipitation techniques requires 'a fundamental understanding of the various processes that occur during precipitation. These pr
Jan 1, 1996
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Recovery of Lithium from the Great Salt Lake BrineBy Rajashekhar Marthi
Lithium is a key component for future electric vehicle batteries and energy storage. The future availability of lithium to meet the growing demands remains in question. Around 60% of lithium resources
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Computer Simulations of Microstructural Development in Dendritic Alloy Solidification with ConvectionBy C. Beckennann, C. Y. Wang
"Computer simulations of structural and compositional development in equiaxed dendritic alloy solidification are performed using a recently developed multi phase model. The model not only accounts for
Jan 1, 1994
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Effect of Iron containing Metallurgical Byproducts on Pulverized Coal Combustion EfficiencyBy Wen Liangying, Zou Chong, Tan Xiuqin, Bai Chenguang, Zhang Shengfu
"Eight typical metallurgical byproducts containing iron were selected based on the effect of the chemical composition, particle size, additives on the burnout degree of pulverized coal. Effect of thre
Jan 1, 2012
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Preliminary Analysis and Method Optimization Based on X-Ray Fluorescence -Application to Precious MetalsBy David J. Kinneberg, Barbara E. Mangion, Arnold M. Savolainen
Analytical laboratories require a qualitative or semi-qualitative method of determining major and minor constituents in "unknown" samples to select optimal analytical techniques. This is exceedingly i
Jan 1, 1999
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump MetallizationsBy Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump Metallizations (0810a053-7c7a-4a4b-be9d-246cf684a53d)By Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003