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By J. C. DeSantis

Thin, highly reflective rhodium films with metal compositions greater than 98% (elemental -weight percentage) have been deposited by chemical vapor deposition using Rh(allyl)3 (ally1 = q3-C3H5) in the presence of a hydrogen plasma. Uniform, crystalline films that adhere well to several types of substrates result from depositions at temperatures as low as 150°C. Depositions using H2 (no plasma), or an argon plasma yields material that is amorphous, contains a significant amount (>14%) of residual carbon, and has a dramatically slower growth rate. The composition of these materials does not vary significantly from that of the materials obtained from the in vacuo thermal deposition with Rh(allyl)3.

Jan 1, 1992

By A. Mikula, S. Karlhuber

"Unique physical and mechanical properties made the Pb-Sn solders attractive for low temperature joining of electronic parts. But since lead in solder materials has become a great enviromental problem and health concern, lead will be slowly replaced by other materials in soft solders. Some of these materials which are currently under investigation are ternary tin alloys. Many different physical properties like wetting behavior, electrical and thermal conductivity and surface tension are measured on these alloys, but on the thennodynamic properties and the phase diagram of the alloys under discussion there is only little information available. We investigated the (Ag, Au, Cu)-Sn-Zn systems and determined the thermodynamic properties over the whole composition range by emf-measurements. From these measurements we also got some information on the liquidus. In the Sn-rich corner the phase diagrams are still under investigation.IntroductionSoldering is technically defined as the joining of two base materials, mostly metals or metal coated nonmetallic substrates, with a third metal. The melting temperature of the third metal or metal alloy should be well below those of the substrates. Solder alloys can be categorized in soft and hard solders. Soft solder alloys usually contain lead, tin, bismuth, indium or cadmium and hard solders gold, zinc, aluminium or silicon. The difference between soft and hard solders is the melting temperature of the soldering material. This temperature is around 350°C.An interesting brief history of solders is given by Vianco and Frear [1]. They report, that in 4000 B.C. solders were already used in Mesopotamia. From archaeoligical evidence those solders were gold-based hard solders.Tin-lead soft solders and their use are not easily found, because in course of time tin has been reduced to stannic acid, making the identification quite difficult. Well preserved soft solder artifacts were discovered in King Tut's tomb dating from 1350 B.C. In ancient time Pb-Sn solders were used primarily for the manufacture and repair of cooking utensils and metal tools. The Romans used lead-tin solders extensively in the construction of the aqueducts."

Jan 1, 1996

By A. W. Bryson, S. P. Fox, S. A. Godorr

"This work is an extension of a previous investigation on the development of surface roughness during electrodeposition of copper. A comprehensive model based on diffusion and migration in a force field together with surface diffusion and sticking probabilities is used to generate profiles which are compared to those produced experimentally. The roughness is characterized by using the technique of fractal geometry which is shown to describe both qualitatively and 9uantitatively the development of surface morphology during electrodeposition.The work is extended to the deposition of copper in the presence of various concentrations of thiourea. The development of roughness is observed experimentally on the edge of a thin copper disc mounted between two glass plates. This enables photographs to be taken at various stages during growth. The surface outline is digitized using an image analyzer which enables the fractal dimension to be determined as growth proceeds. As expected, the presence of thiourea at low concentrations produces a fractal dimension which is closer to unity (i.e. the surface becomes smoother).IntroductionThe development of surface morphology during electrodeposition has far-reaching implications for copper plating in the electrowinning and electrorefining processes. Short circuits as the cathode surface grows unevenly require operator intervention in a dangerous environment and imply processing delays, and the inclusion of electrolyte in small gaps in the plated cathode have implications in downstream processing of the cathode. Higher current densities are obviously desirable, as they result in greater production rates, but as shown by Ettel et. al.(l), Harvey et. al.(2), Cook (3), and Harvey et. al.(4), it is not possible to operate near the projected economically optimum conditions because the electrodeposition of copper from sulphate and acid solutions is a mass transfer controlled process. It has been shown (Ettel et. al.(l), Harvey et. al.(2)) that the closer a system operates to mass transfer limiting conditions, the poorer the resulting cathode quality. One solution is to use agitation techniques to increase the limiting current density. Another is to add surface active additives to the electrolyte which has been shown by Ettel et. al.(l), Harveyet. al.(2) and Afifi et. a1.(5) to allow higher rates of production without decreasing cathode quality. The second proposed solution is of interest in this work, since there is very little knowledge of the conditions under which these additives operate effectively, and little fundamental understanding of the mechanism by which they operate. The current work seeks to contribute to this field by correlating a simulation model with experimental results to describe the development of surface morphology in the electrodeposition process."

Jan 1, 1997

By B. Q. Li, H. C. de Groh, X. Lu

"A fully 3-D, transient finite element model is developed to represent the magnetic damping effects on complex fluid flow, heat transfer and electromagnetic field distributions in a metallic melt. The model development is based on our in-house finite element code for the fluid flow, heat transfer and electromagnetic field calculations. The numerical model is tested against numerical and experimental results for water as reported in literature. Various numerical simulations are carried out for the melt convection and temperature distribution with and without the presence of a transverse magnetic field. Numerical results show that magnetic damping can be effectively applied to stabilize melt flow, reduce turbulence and flow levels in the melt and over a certain threshold value a higher magnetic field resulted in a greater reduction in velocity. Also, for the study of melt flow instability, a long enough running time is needed to ensure the final fluid flow recirculation pattern. Moreover, numerical results suggest that there seems to exist a threshold value of applied magnetic field, above which magnetic damping becomes possible and below which the convection in the melt is actually enhanced.1. INTRODUCTIONThe imposition of a DC magnetic field on a moving, electrically conducting fluid, such as molten metal or semiconductor melt, produces an opposing Lorentz force that results in a reduction of flow velocity in the liquid. This effect has been explored in both the semiconductor and metals industries to control natural convection and/or surface tension induced Marangoni convection as well as thermally induced flow instability during solidification processing of these melts [1-6]. A mathematical model can be of great use in developing both fundamental understanding of the fluid-magnetic field interactions in these magnetically-assisted processing systems and basic guidelines for process design, control and optimization.This paper presents a 3-D mathematical model for magnetically damped fluid flow and heat transfer in a melt cavity, which is useful for interpreting results for unidirectional solidification processes at slow solidification rate, and some preliminary results concerning the magnetic damping effects on the flow instability in the melt. The model development is based on the finite element solution of the Navier-Stokes equations, energy equations and equations for induced electric field. The model is tested against reported results and is then applied to study the fluid flow and thermal distribution in the metallic melt with and without an external magnetic field."

Jan 1, 1999

By R. E. Aune

In the present work, a critical assessment of the thermodynamic information available for the ternary system Ni-W-0 has been carried out; This was complemented by experimental measurements of the standard Gibbs energy of formation of the ternary compound NiWO, by solid state galvanic studies involving Zr02-CaO solid electrolyte. The assessed thermodynamic data, together with the phase diagram information available in literature, were employed to generate the ternary phase diagram for the system Ni-W-0 in the temperature range 1073-1273 K. The calculation of the phase diagram was carried out by computer optimization according to the "CALPHAD" method. The computed phase diagram has been confirmed at isothermal sections by identification of the phases present in samples equilibrated at defined temperatures.

Jan 1, 1994

By D. Georgiou

Direct sulphuric acid leaching of nickeliferous limonites is the process of choice to recover nickel and cobalt from equatorially located lateritic ores. These ores are rich-in-iron (-45 wt%) existing in the form of goethite enriched with nickel. The merit of this process is due to its high nickel selectivity because of simultaneous iron separation and acid regeneration. Under acid leaching conditions (-250 to 270°C) iron follows an acid dissolution-hydrolytic precipitation path yielding a very low concentration level depending on temperature and acidity of the final leach liquor. The primary precipitation product of iron is hematite which also forms as a scale on reactor internals along with co-existing aluminum. In this paper, an overview of the behaviour of iron solid products under process conditions is made. The evolution of goethite to hematite transformation, as well as the role of iron in reactor scale production, are studied using SEM/EDX characterization techniques.

Jan 1, 1995

By Kenji Morinaga, Shigeru Fujino

"Preparation and vacuum ultraviolet (VUV) transmission spectra of aluminum fluoroberyllate glasses, MgF2-CaF2-SrF2-A1Fr BeF2 (MCSA-Be) and MgF2-CaF2-SrF2-AlFrYFrBeF2 (MCSAY-Be), were studied. The influence of YF3 and BeF2 on the thermal stabilization against crystallization and VUV transmittance was investigated. With increasing the BeF2 content, the crystallization tendency decreased and the absorption edge shifted to shorter wavelength in the MCSA-Be and MCSAY-Be glasses. The MCSA-20Be glass composition exhibited the shortest wavelength UV absorption edge (-147 nm) and the highest transmittance at 157 nm (60% for 2 mm sample thickness). The transmission values at 157 nm and the slope (steepness) of the absorption edge were found to be significantly influenced by the trace amount of Fe2+ derived from the BeF2 raw materials.IntroductionPure beryllium fluoride is known to be an only fluoride that forms one component glass on cooling from the molten state and is structurally similar to silica with [SiO4]4- tetrahedra. Molten BeF2 is highly viscous with a viscosity of about 106 poise near its liquidus temperature at 550""C[l]. The addition of modifying fluorides such as LiF, NaF or KF to BeF2 substantially decreases the viscosity[2]. Glass forming region of binary fluoroberyllate glasses has been mainly reported by several authors [3]. LiFBeF2 binary system is structually analogy for Mg0-Si02 system from their phase diagram and ratio of ionic radius for each cation and anion, respectively. LiF-BeF2 binary glasses seems to be promising candidates for the extreme deep vacuum ultraviolet (VUV) transmitting optical materials owing to their larger band gap. However, it is chemically unstable, and so, have no practical application for lens systems in micro lithography equipments and substrate materials for F2 (157nm) excimer laser[4]. There are also few reports on the VUV transparency of multicomponent aluminium fluoroberyllate glasses from the view point of their compositional dependencies. The purpose of this paper is to prepare deep VUV transmitting optical materials and determine the optimum glass compositions for aluminium fluoroberyllate glasses investigating their thermal stabilization against crystallization."

Jan 1, 2000

By Miaoyong Zhu, Sen Luo

"A two-dimensional CAFD model was developed for simulating the solute diffusion-controlled dentritic growth in the low Peclet number regime. Mass conservation and local equilibrium at the solid/liquid interface were solved to determine the growth velocity of interface with consideration of constitutional and curvature undercooling. The modified decentered square growth proposed by Wang et al was adopted to capture the first eight neighboring cells. The comparison between the classic Lipton-Glicksman-Kurz (LGK) analytical model for steady state tip variables and the simulated values showed that the present model was capable of quantitatively determining the dendritic growth, and the simulation tests demonstrated that the effects of the mesh anisotropy in growth kinetics and crystallographic orientation were eliminated. The numerical simulations were performed to the dendritic growth ofFe-0.6%C binary alloy in undercooled melt, and the results showed that the present model could predict the dendrite morphology with artificial growth orientation in acceptable level.IntroductionDuring the solidification of metals and alloys, the dendrite grows from the substance or the undercooling melt and solute redistributes between the dendrite and the interdendritic liquid. The solidification microstructure is close related to the phase and solute evenness and has a close linkage with the properties of final production.In the past few decades, various kinds of deterministic and stochastic models have been developed to predict the evolution of microstructures in solidification, with the fast development of computer power. Among these methods, Phase Field (PF) model [1, 2] has been known as one of the most adequate deterministic models for directly simulating the dendritic growth. However, there is a vital drawback that the PF method requires considerable computation time and is limited to simulate very small domains with a few dendrites [3]. On the other hand, stochastic models, such as Monte Carlo (MC) method [4, 5] and Cellular Automaton (CA) method [6-8], have been usually applied to predict the solidification microstructure evolution. Comparing with the MC method, the dendritic growth kinetics is explicitly integrated in the CA model, while the MC model doesn't. Therefore, the CA method is more reasonable to predict the dendritic growth during the solidification of melt."

Jan 1, 2013

By Stavros A. Argyropoulos, Henry H. Hu

"The assimilation of exothermic additions in liquid metals exhibit an array of unique coupled heat, mass and momentum transport phenomena. These phenomena are further complicated by the presence of a moving boundary.This paper describes a) A mathematical model which simulates the complex phenomena, and b) An extensive verification of the mathematical model. The SIMPLER algorithm was employed to solve numerically the pertinent partial differential equations. The computational results indicated that the exothermic heat of mixing led to a rapid increase in temperature around the moving boundary, which produced an enhanced convective flow in the liquid phase. The intensification of fluid flow around the moving boundary resulted in an acceleration of the melting process.Verification of the model was carried out in two contexts. The first was, in a low temperature physical model consisting of ice immersion in different sulfuric acid solutions. In this physical model, both temperature and velocity measurements were carried out. The model results were compared with experimental measurements and they were found to be in excellent agreement. The second context employed high temperatures, involving the assimilation of silicon in high carbon liquid iron. The model was also applied to predict fluid flow, heat and mass transfer for these high temperature experiments and a good agreement was obtained.In addition new dimensionless heat transfer correlations that quantify these complex phenomena will be presented."

Jan 1, 2001

By Lucas Nana Wiredu Damoah, Lifeng Zhang

"The use of electromagnetic field to remove suspended particles from metals such as aluminum by pushing to the boundary has been well studied. However, the potential of this method is yet to be exploited for the removal of inclusions from silicon. Considering the increasing amount of Top-cut SoG-Si scraps year upon year, there is the need to harness all the potentials of technologies to recycle this materials to ensure sustainability. This study investigates, and discusses new results on the effect of processing parameters such as composition, coil current, and frequency on the removal of inclusions from silicon under high frequency AC electromagnetic field.IntroductionThe solar cell silicon making industry requires pure and clean silicon in order to maximize the conversion potential of the solar cell material. The conversion efficiency of solar cells is limited by minority carrier recombination at dislocations and those intra-granular defects such as impurities, small clusters of atoms, or precipitates [1]. Recent global developments in the energy sector with a drive for the production of clean, reliable, and affordable energy have stirred a rapid growth in the production of photovoltaic (PV) cells.[2] Thus over the years, silicon based PV cells has seen a lot of growth as it has a PV market share of over 90 % [3] either as single-crystalline silicon, or multi-crystalline Si (MC-Si), or amorphous Si [4]. MC-Si produced by directional solidification of solar grade silicon melt dominates the silicon PV market. During the directional solidification process, SiC and Si3N4 particles within the melt are pushed by the solidification front to the top of the ingot which is the last to solidify. Therefore the top of the ingot is cut generating what is known as top-cut solar silicon scraps. The Si3N4 particles are mainly from the coating material at the inside surface of the silica crucible and from the air absorption during solidification process. The SiC particles mainly stem from the carbon reduction process of the primary production of silicon [5]. For sustainability the silicon in the top-cut silicon scraps must be recovered. Therefore methods for removing non-metallic particles, such as SiC and Si3N4, from the silicon are important in order to recycle the top-cut scraps to a useful feedstock for the silicon solar cells manufacturing."

Jan 1, 2012

By Sumantra Mandal

The hot deformed microstructure of the 15Cr-15Ni-2.2Mo-Ti modified austenitic stainless steel (commonly known as alloy D9) was investigated employing electron backscatter diffraction (EBSD). Hot compression tests were conducted in a Gleeble thermo-mechanical simulator at temperatures of 1173K-1373K (in steps of 100K) with a strain rate of 10 and 100 s-1 to different strains. Various kinds of deformation patterns were observed inside the deformed grains. These were inferred as the development of geometrically necessary boundaries or formation of parallel set of micro-bands. Recrystallized grains were partitioned from the deformed grains employing grain orientation spread approach. Extent of dynamic recrystallization (DRX) was found to be minimal at 1173K. DRX was predominantly found to happen at and above 1273K which increases with increase in strain. DRX nucleation and development mechanisms were discussed with respect to bulging of the parent grains and sub-grain rotation. Special emphasize is given on the role of annealing twins on DRX nucleation and subsequent expansion.

Jan 1, 2009

By T. Gunawansa, T. L. Alford, Zhao Zhao, A. R. Lanz, N. David Theodore

Many sustainability issues arise during the manufacturing processes that are currently used for solar cells. Solar energy is a renewable energy source that is independent of the earth’s resources, and it is therefore important for the development of more sustainable technologies. Microwave annealing (MW) has been proposed as a technically feasible fabrication scheme for large area silicon solar cells. Apart from that, microwave annealing has been demonstrated to be a promising alternative for repairing damage and electrically activating dopants in ion-implanted semiconductors for integrated circuit manufacturing. A microwave oven is cheaper than conventional furnace systems. In addition, microwave heating is much more efficient than conventional furnace heating, as heating is directly produced inside the material. This minimizes the loss of energy due to heating of the ambient. There is a need for more efficient processing techniques. In this study, microwave annealing is used as an alternative to the current postimplantation processing. Arsenic-doped silicon was microwave annealed (with an aluminacoated silicon carbide susceptor) to activate dopant atoms and to repair damage that was caused by ion implantation. Sheet resistance and Hall effect measurements were used to assess the extent of dopant activation. Rutherford backscattering spectrometry (RBS) with ion channeling was conducted to determine the extent of recrystallization. The dopant activation and recrystallization resulting from microwave annealing is compared with that resulting from conventional rapid thermal annealing (RTA) with the same heating profile. The results show that when compared to RTA, susceptor-assisted microwave annealing results in better dopant activation for shorter anneal times under the same heating conditions.

Jan 1, 2015

By Qian Li, Haiyan Leng, Kuo-Chih Chou, Haoyuan Xiao, Zhigang Yu

Magnesium borohydride and Magnesium alanate were synthesized by mechanochemical metathesis reaction. The thermal decomposition behaviors of Mg(BH4)2-nMg(AlH4)2(n=0.5,1) systems were investigated as potential hydrogen storage materials. The results showed that the systems started to desorb H2 at 120 ℃ and desorbed 3.9 wt. and 4.9 wt.% H2 below 300 ℃ when n equals 0.5 and 1, respectively, while individual Mg(BH4)2 started to desorb H2 at 250 ℃ and desorbed only 0.82 wt.% H2. Because of the exist of the Mg(AlH4)2, the isothermal desorption kinetics of Mg(BH4)2 in the Mg(BH4)2-0.5Mg(AlH4)2 systems was 50% faster than that of pristine Mg(BH4)2. In addition, the re-hydrogenation rates also increased 49.4% and 37.9%.

Jan 1, 2015

By Liwen Hu, Jianxun Song, Hongmin Zhu, Qiuyu Wang, Shuqiang Jiao

The subchloride titanium was prepared by sponge titanium and titanium tetrachloride in the CaCl2 at 1173 K. The species were detected are mainly titanium dichloride, and the average valent in the melt are 2.05. The accurate equilibrium constants were obtained for the reaction 3Ti2+ = 2Ti3++Ti after the accurate activities of titanium chloride were evaluated with emf method, and the observed deviations from ideal behavior are discussed.

Jan 1, 2015

By M. T. Ernett

Significant amounts of arsenic are often present in effluents arising from the mining of sulfide ores for the extraction of metals such as copper, gold, lead and zinc. The arsenic is usually removed from the process effluent by co-precipitation with iron because of its common occurence in the mined ore bodies and the excellent adsorptive property of the precipitated hydrous ferric oxide compound. There has been controversy, however, over the long-term stability of the arsenic-bearing ferrihydrite which is produced. This paper presents the results of laboratory studies which indicate that the cations of calcium, magnesium, zinc, cadmium and lead, increase the pH range of effective arsenic adsorption in the Fe-As precipitate from 4-7 to 4-9. The increase in the pH range is similar for all of the added cations investigated. Sulphate ions are shown to have a minimal effect on the residual dissolved arsenate concentration. Silicate ions reduce the adsorptive capacity of ferrihydrite if they are present before the arsenic is adsorbed.

Jan 1, 1994

By Gabriel Riveros

Fire refining of copper consists of two stages copper oxidation and copper reduction. Very frequently the capacity of the anode furnace is determined by the rate of copper reduction, The analysis of factors affecting the rate of the oxygen reduction from a liquid copper with solid carbon or injected hydrocarbons pointed out the role of the mass transfer in a liquid copper in final stage of the reduction. Experimental results of copper reduction with graphite and injected natural gas in laboratory-scale crucibles showed two stages of the reduction process with a sharp change of the controlling mechanism. The estimated dynamic surface area of gas bubbles based on the measured bubble frequency and the gas flowrate allowed for the determination of the reaction constant as a degree of the partial pre-combustion of the air/natural gas mix. The variation of the used reductant as a function of the oxygen concentration and temperature has been evaluated based on the determined kinetic model. The intensification of copper reduction in fire refining has been discusses on the basis of obtained kinetic data and analysis of various factors determining the time of reduction.

Jan 1, 2003

By H. Kamarudin

The behaviour of cassiterite-sulphosuccinamate flotation system was examined in the light of zeta potentials measured by micro-electrophoresis method. It was observed that sulphosuccinamate substantially affects the zeta potentials of cassiterite, lowering its i.e.p. to pH 2.5 and indicating a specific adsorption and/or chemical interaction. The optimum concentration for flotation, as seen in micro-flotation tests, was found to be associated with the most effective lowering of the zeta potentials, the optimum pH being 3.0. The effect of cations in the pulp was examined for the presence of ferrous, ferric, aluminium and lead ions. The ions ferric and aluminium were observed to create an intense effect of increasing the potentials to positive side, possibly due to adsorption of cation hydroxy complexes, as indicated by their respective species distribution diagrams.

Jan 1, 1994

By John L. Hostetler

GALFAN, the Zn-5% Al-mischmetal hot-dip galvanizing alloy is coated onto steel sheet, wire, and tube using high-speed continuous galvanizing lines. Factors critical to producing high quality GALFAN are reviewed, The relationship between minimum mischmetal content in the GALFAN alloy and furnace dewpoint will be described. The relationship between peak annealing temperature and furnace dewpoint will also be shown. Typical suategies for operating multi-purpose hot-dip galvanizing lines including GALFAN will be described. A recent development has allowed preparation of steel smp for GALFAN coating using aqueous fluxes rather than high temperature annealing. This allows production of GALFAN-coated smp without over-ageing of the steel, and allows high steel strengths and hardnesses to be obtained. The principles of this process will be described.

Jan 1, 1992

By Abhishek Lahiri, Animesh Jha

"A new technique for the selective separation of rare earths and impurities from lower grade titaniferous ores has been developed which will reduce the overall reduction in the energy costs, and therefore the CO2 generation by at least an order of magnitude during the chlorination and waste handling stages of TiO2 to TiCl4 reaction. The process includes roasting the ilmenite ore with alkali followed by water washing step, which removes nearly 80% of oxides of lanthanide and actinide elements present in lower grades of titaniferous minerals. In the context of preferential separation of rare- 3+ + earth and actinide oxides, we have examined the roles of Al and K ions on the lattice structures of ilmenite and complex titanate as the product layer forms during the roasting in air in the presence of potash. The composition of the mixtures of oxides derived from the separation process shows that the mixture of rare-earth oxides m ay be a high-value co-product of the overall beneficiation process.IntroductionWorldwide the production of synthetic rutile is carried out either by the sulphate or the slag-making followed by fluidised bed chlorination of TiO2 enriched slag granules. The chlorinated gas is then re-oxidized to make white pigment grade TiO2. The waste generated by the sulphate process is predominantly iron sulphate, which has limited use in the water treatment plant. The remaining wastes from the sulphate process undergo further treatment using filtration followed by evaporation and thermal decomposition after which it is disposed into deep sea. On the other hand the chloride waste is extremely hazardous and requires special case by neutralisation, followed by impoundment in a managed pond, where it is monitored for long-term for potential contamination to the soil and ground water. Rare-earth and prelanthanide wastes often end up in the pond where they are diluted and irretrievably lost for further use or recycle. Certain parts of the world the chloride process wastes are pumped via deep boreholes into porous geological strata. The present techniques of disposal are not only expensive but also pose continued threat groundwater and soil and marine life in case of sulphate waste [1, 2]."

Jan 1, 2009

By N. Ono, H. Fujiwara, S. Otsuka-Yao-Matsuo, T. Omata

"The electrical conductivity and the oxygen release and uptake of sintered indium tin oxide (ITO) upon heating and cooling under the condition that P(O2)/P*=4.9X10-4 (P* = atmospheric pressure), :when P(O2) was approximately 50Pa, were simultaneously measured by using a closed-system oxygen-gas analyzer. A large increasing in -the electrical conductivity - upon the· oxygen release detected in 1130<T<1273K was observed. Quantitative relationship between the number of oxygen atom released from ITO and the conduction electron density in ITO was studied. The release of one oxygen atom agreed with the generation of two conduction electrons, i.e., the efficiency-carrier-generation for the oxygen release from the ITO was almost one. The oxygen atom released must be originally at the quasi-anion site in the C-type rare-earth lattice, i.e., the 16c site in the space group of Ia3, as an interstitial excess oxygen, Oi"". It was concluded that the mechanism of conduction carrier generation and compensation upon SnO2 doping into In2O3 can be expressed by the defect equation, 2SnO2-2Sn1n +2(1-z)e'+zOi""+3O0 x+(l-z)/2O2, and that the oxygen release bringing the increase in the electrical · conductivity can be expressed by the equation, Oi""-1/2O2+2e'.IntroductionThin films of SnO2-doped In2O 3 (generally designated as ITO, for indium tin oxide), which have high optical transparency for visible light and high electrical conductivity, have been used as transparent electrodes for liquid crystal and electrochromic displays. It is well known that the electrical conductivity of ITO depends on the content of SnOi-dopant and oxygen. However, a reliable relationship between electrical conductivity and the absolute oxygen content in ITO has yet to be reported. The elucidation of such a relationship is one of the important clues for realizing extremely highly conductive ITO electrodes."

Jan 1, 2000