Zinc-A Possible Component In Lead-Free Solders (Keynote) (eeb8536d-aa40-42f4-a0cf-853c0a6fdb6d)

- Organization:
- The Minerals, Metals and Materials Society
- Pages:
- 9
- File Size:
- 468 KB
- Publication Date:
- Jan 1, 2003
Abstract
Lead-tin solders are commonly used in electronic packaging due to their unique combination of electrical, chemical, physical, thermal and mechanical properties. Since it is known that lead and lead containing alloys cause great environmental concern and health hazards it is necessary to replace lead in solder materials. Besides the environmental concerns new technologies in electronic packaging require new and improved solders. In most cases the new solders will consist of temary or quarternary alloy systems, the main component will be tin or indium and the second element could be bismuth. silver, copper and gold and to improve certain properties a third element will be added. For a third element zinc, nickel, antimony and aluminum can be considered. This report will concentrate on solders containing zinc as an environmental safe. element.
Citation
APA:
(2003) Zinc-A Possible Component In Lead-Free Solders (Keynote) (eeb8536d-aa40-42f4-a0cf-853c0a6fdb6d)MLA: Zinc-A Possible Component In Lead-Free Solders (Keynote) (eeb8536d-aa40-42f4-a0cf-853c0a6fdb6d). The Minerals, Metals and Materials Society, 2003.