Two-Stage Crushing For Concentrating Minor Rare Metals from E-Scrap

The Japanese government enforced the "Small Domestic Appliances (SDAs) Recycling Law" in 2013. The law targets metals such as Ta, Nd, Dy, Co, and W to be recycled. Considerable amounts of these minor rare metals are mounted on printed circuit boards (PCBs) of the SDAs and/or e-scrap (electric and electronic scraps). Although precious metals and copper can be recovered from the e-scrap in non-ferrous metals smelters, most of the minor rare metals report to the slag in these smelters in non-recoverable forms. These metals are often used in particular types of devices, and therefore it is possible to concentrate them by separating such devices before feeding to the smelters. In previous work we developed technology for "Device Separation" to concentrate several minor rare metals, but some problems remained, such as how to remove the PCBs from e-scrap bodies, and how to detach devices from PCBs after their removal from escrap bodies. This paper proposes a two-stage crushing process in which, firstly, PCBs are removed from the e-scrap body with various crushers, and secondly, devices are detached from the PCBs involving the application of elevated temperatures. It was found that in the first stage, crushers with physically flexible rotating media such as chains, which provide high collision probability with the sample and consume relatively low energy, can quite effectively separate the PCBs from the e-scrap bodies non-destructively. In the second stage, heating was found to be remarkably effective in helping to detach mounted devices from PCBs, also non-destructively. This paper will also discuss the detailed mechanism of the heating effect on the detachment of devices from PCBs.