The Metal Injection Molding of the Nanostructured W-Cu Powder Prepared by Mechanical Alloying

"Recently, W-Cu alloy becomes one of the very important candidate materials for heat sink and packaging in the field of microelectronics due to its good thermal properties. The metal injection molding of W-Cu powder can satisfy the requirement for mass production of complex shaped parts in microelectronic devices. In the present study, the application of MIM process to the nanostructured W-Cu powder prepared by mechanical alloying was investigated. The multi-component binder system of 45PW+ l 5BW+ 30PE+ I OSA was proven to be suitable one for the MIM of the W-Cu composite powders by adopting the debinding cycles of multi-stage in N2 and H2 atmospheres. Other process conditions for the MIM of the nanostructured W-Cu composite powder were also studied. The MIM debinding part of W-30wt.%Cu was sintered to the relative density of more than 96% by sintering at 1200 °C for !hour in H2 atmosphere. Such an improvement of sinterability was attributed to the intrinsic homogenous and fine mixing state of W-Cu phases in nanostructured W-Cu composite powders, and also partly to the effect of the activated sintering by the presence of impurity introduced during the extensive milling.IntroductionW-Cu alloys have been widely used for heavy duty electrical contacts and arcing resistance electrode(1-2). Recently there has been a growing interest in this W-Cu alloy because of its superior thermal managing properties and its high micro wave absorption capacity(3). Such W-Cu alloy parts are conventionally fabricated either by the Cu infiltration sintering technique or by hot pressing of W-Cu powder mixtures. However, these conventional PM techniques are hardly applicable for mass production of small size parts with a complicated shape such as the parts required for microelectronic devices. The metal injection molding(MIM) technique is potentially applicable for the mass production of small and complicatedly shaped parts compared with other PIM forming techniques."