The influence of processing parameters on TLP joining of Inconel 617 alloy

In the present work TLP bonding of Inconel 617 is investigated. The influence of the main processing parameters i.e. time and thickness of the interlayer were studied with optical and scanning electron microscopy. Boron containing interlayers with two different thicknesses were used and the influence of various holding times from 5 min to 24 hours on the microstructure of the bond region was investigated. The results indicated that, for the testing temperature of 1065°C and holding times above 2 hours with an interlayer of 25.4 microns thick no liquid phase was observed. The same phenomenon occurred only after 6 hours for a 76.2 microns thick interlayer. Precipitate growth started at grain boundaries and continued inside the grains. The composition, size and morphology of the precipitates were studied using electron microprobe analysis. No noticeable changes were observed in the grain size of the base metal with increasing holding times.