The Effect of Organic Additives on the Electrocrystallization of Copper

The behaviour of thiourea, animal glue and chloride ions in the electro¬lysis of copper has been investigated by various different electrochemical experiments, i.e. polarization curves with stationary copper electrodes, long-time galvanostatic electrolyses and Hull cell experiments. Polarization curves with stationary copper electrodes show that animal glue has a polarizative effect on the deposition potential. Small thiourea contents affect depolarizatively when high concentrations retard the copper deposition. The microstructures of the deposited copper after the long-time electrolyses show that animal glue favours a basis oriented deposition structure. With thiourea the field orientated structure was evident. It was also observed that the deposited structure depended much on the grain structure of the starter sheet. The chloride ion concentration has a drastic effect on. the crystal size of the deposited copper as it was found out in Hull cell tests. Chloride ions flattened the the crystals and the deposition became smoother when the chloride ions were added. The cathode copper quality is discussed according to the literature. Special attention is paid on the codeposition of thiourea and the origin of sulphur impurities in copper cathodes.