The Effect of Inactive Glue Batches Identified Using the Collamat System

Glue, thiourea and chloride are the common reagents which are used in copper electrorefining to achieve fine-grained and smooth copper deposition. While thiourea and chloride are clearly defined chemical substances, glue is a natural product consisting of a mixture of amino acids in different constituent parts. The amino acids are continually degraded in the electrolyte by hydrolysis until they finally become completely inactive. This effect is well-known, largely constant and balanced by the continuous dosing of glue. In contrast, the behaviour of glue in the batch container is not always foreseeable. The glue can become partly or completely inactive by contamination with acid or bacteria, for instance. Usually this is not noticed, and partly or fully inactive glue is added to the electrolyte over a longish period, with the result that the copper growth is significantly impaired. Examples from operational practice show that, with the help of the CollaMat system, partly or fully inactive glue batches can be quickly detected.