Technical Notes - Recrystallization Textures in Copper Wire

RECENTLY Wallbaum¹ found that copper wires with different degrees of deformation up to 98.7 pct area reduction recrystallize giving a [112] texture, while deformation over 98.7 pct gives either a [l00] texture at low temperatures or a [1ll] texture at high temperatures. Furthermore it was found that the recrystallization temperature as a function of deformation up to 98.7 pct decreases as expected, but increases over that deformation. Wallbaum concluded that the different textures have different recrystallization temperatures. The [112] texture has the lowest and [Ill] the highest. At the same time Bassi² found that for high deformation (over 99 pct area reduction) and for an annealing temperature of 400°C, the [l00] texture first forms and with prolonged annealing time the [12] texture appears through grain growth. This secondary texture does not appear if the wire is annealed at 1000°C before the deformation. From these two papers it might be concluded that the [I12] texture can appear either as a primary or as a secondary texture after annealing. The texture formed in a special case depends on the previous history of the wire. Probably the texture of the wire prior to the last deformation is important. To investigate this, wires were produced by adequate deformation and annealing to give a [l00], a [112], and a [lll] texture. The wires then were given a series of different deformations and were annealed at various temperatures, after which the textures were studied. Experimental Work The copper used was electrolytic tough-pitch (Cu 99.90 pct and 0, 0.04 pct). Three wires with the different initial textures were made in the following way: The [l00] and [112] by drawing a 16 mm rod to 1 mm and annealing it 16 hr at 200°C and 2 hr