RI 9590 - Adhesion of Diamond Films on Tungsten

The U.S. Bureau of Mines has investigated the chemical vapor deposition of diamond films on tungsten substrates. The effects of deposition parameters on the adhesion of the films was determined. The films were produced using a hot filament chemical vapor deposition system. Parameters investigated were substrate temperature and methane concentration in the feed gas. Film quality, morphology, and composition were characterized by scanning electron microscopy and Raman spectroscopy. Adhesion testing was performed using an indentation technique, and the results were quantified by relating adhesion to interface fracture toughness. Diamond films with well-faceted crystalline morphology with grain size greater than 1 µm had poor adhesion properties regardless of substrate temperature or methane concentration. Diamond films with smooth morphologies consisting of rounded clusters of small (<0.2 µm) diamond crystallites and amorphous carbon phases displayed much higher adhesion, although the conditions that led to the growth of these films are not understood.