Recovery of Copper from Printed Circuit Boards Using Ammoniacal Alkaline Solution

Canadian Institute of Mining, Metallurgy and Petroleum
K. Koyama T. Oishi M. Tanaka S. Alam
Organization:
Canadian Institute of Mining, Metallurgy and Petroleum
Pages:
10
File Size:
371 KB
Publication Date:
Jan 1, 2012

Abstract

"A novel hydrometallurgical process for copper recovery from waste printed circuit boards has been proposed, which consists of selective leaching of copper metal as Cu(I) by Cu(II) in ammoniacal alkaline solution, purification, and electrowinning. The distinct feature of this process is much lower power consumption during the electrowinning than that during the conventional one from acidic copper sulfate media, because the deposition of copper metal from Cu(I) at the cathode and the oxidation of Cu(I) to Cu(II) at the anode take place in the present method. In the laboratory-scale tests using waste printed circuit boards, high purity copper which contains 1.1ppm of impurities was obtained in a chloride system. INTRODUCTIONThe recovery of various metals from waste materials is an important issue in order to conserve the environment and metal resources. Copper is used for cables, electric appliances, etc., and is currently a very important material for industries and will continue to be in the future. Among the wastes that contain copper, one of the most complex recycling materials is electronic scrap like printed circuit boards (PCB), which generally contain 10-30% copper as well as plastics, fibreglass and other metals. There are two ways to recover copper, either pyrometallurgical or hydrometallurgical. Hydrometallurgical treatments generally have more flexibilities in the process scale and control. The separation processes tend to become complicated because of the poor selectivity during the leaching in the sulphuric and hydrochloric acid media. On the other hand, the use of ammonia as a complexing agent, gave a higher selectivity for copper leaching (Nigo, Majima, Hirato, Awakura, & Iwai, 1993; Majima, Nigo, Hirato, Awakura, & Iwai, 1993; Zhou, Shinme, & Anezaki, 1995; Koyama, Tanaka, & Lee, 2006) .In this study, recycling process containing leaching, copper deposition at a cathode and oxidation of copper(I) at an anode from ammoniacal alkaline solutions containing Cu(I) or Cu(II) is introduced. Furthermore, copper recovery from a waste printed circuit boards and impurity behaviour was examined in ammonia-ammonium sulfate (sulfate system) and ammonia-ammonium chloride (chloride system) systems."
Citation

APA: K. Koyama T. Oishi M. Tanaka S. Alam  (2012)  Recovery of Copper from Printed Circuit Boards Using Ammoniacal Alkaline Solution

MLA: K. Koyama T. Oishi M. Tanaka S. Alam Recovery of Copper from Printed Circuit Boards Using Ammoniacal Alkaline Solution. Canadian Institute of Mining, Metallurgy and Petroleum, 2012.

Export
Purchase this Article for $25.00

Create a Guest account to purchase this file
- or -
Log in to your existing Guest account