PART XII – December 1967 – Communications - Resistivity Studies of Defect Concentrations Resulting from Cyclic Stressing of Copper Single Crystals at Room Temperature

FROM indirect evidence point defects have been believed to influence the fatigue behavior of metals and alloys.1,2 Measurements of changes in resistivity made after cyclicstressing at low temperatures indicate that a very high density of defects is present, part of which may be removed by room-temperature annealing.3'4 These results are consistent with the generation of a high number of point defects at low temperatures. Corresponding measurements made after room-temperature stressing did not show any recovery effects.3 This was attributed to a stabilization of the dislocation network after a few thousand cycles without generation of vacancies. In this laboratory resistance measurements of copper single crystals, shaped as normal fatigue specimens ,5 have been made with a Kelvin double bridge at room temperature during and after cyclic stressing at 80 cps by comparing with a dummy at a close and constant temperature. Temperature differences were measured to ±0.025°C with fine thermocouples taped onto the gage lengths. Potential leads were tin-soldered into small holes in the gage length to give stable values. Corrections for differences in temperature and changes in mean length of the specimen were made according to the formula: