PART V - Communications - The Effect of Rearrangement in Liquid-Phase Sintered W-Ni-Cu Alloys

The authors have previously investigated the solid-state activated sintering of tungsten powder with various Ni-Cu additions.' Log shrinkage vs log time plots showed changes in slope from 4 to x at intermediate times during the sintering process. This was attributed to a change in the rate-controlling mass-transport process from solution of tungsten into the tungsten-alloy interface to diffusion of tungsten in this interface. It was postulated that the melting of the activating layer should not affect this transport process. However, the superposition of rearrangement due to the presence of a liquid phase complicates the data analysis. It is the purpose of this note to apply the analysis of Prill, Hayden, and rohy' to account for "rearrangement shrinkage'? in liquid-phase sintering of the W-Ni-Cu system. This results in "solution-precipitation stage" shrinkage plots which were comparable to those obtained in solid-phase activated sintering of the same system. If one assumes total shrinkage to be the sum of rearrangement and solution precipitation, the effects can be isolated easily.2 This results in the general equation: