Part IV – April 1968 - Papers - Grain Growth and Recrystallization in Thoria-Dispered Nickel and Nichrome

It has been found that cold work and annealing treatments greatly retard subsequent grain growth and re-crystallization in thoria-dispersed nickel and NiCr. It is suggested that this is due to cavities which form at the particle-matrix interface durilzg cold work. Some of' the cavities formed are stable at elevated temperatures and prevent the mouement of large-angle grain boundaries. The movement of these boundaries at elevated temperatures is known to start recrystal-lization and when they are pinned by voids recrystal-lization is made more difficult. TD Nichro,me had a maximun resistance to recrystallization when the initial structure was coarse-grained and had a low dislocation density. A precipitation reaction occurred between 700° and 1200° F in cold-worked TD Nichrome. It has been shown by Grant and his coworkers1-3 that a large part of the strength of dispersion-hardened materials is a result of the cold-worked structure produced during fabrication. In a comparison of the strength of cold-worked copper with and without an oxide dispersion, Grant4 has demonstrated that there is little difference in strength at room temperature. The function of the dispersion is essentially to maintain the cold-worked structure at higher temperatures than is possible in the base material. The dispersion accomplishes this by making recrystallization more difficult. The mechanism by which this is achieved is discussed in this paper. The fabrication history of the material has been found to greatly influence recrystallization behavior and this aspect is discussed in some detail. I) MATERIAL Three different thoria-dispersed materials were examined. 1) DuPont 2 pet thoria-dispersed nickel (TDNi) in 0.050-in. seeet. Thoria particle size is in the range 100 to 2500A. 2) DuPont 2 pct thoria-dispersed nichrome (20 pet Cr, 80 pct Ni) (TDNiC) in 0.125-, 0.060-, and 0.040-in. sheet. In the as-received condition these sheets have