PART II - Communications - Removal of Impurities in Copper by a Halide-Carrier Technique

REGARDLESS of the degree of purification effected during the electrorefining of copper, a danger of re-introducing impurities exists in the operation of melting and casting of the refined copper. Logically only a combination of the purification and casting operation would remedy the situation. A well-known method of metal purification is the "Gross"-type process, whereby a volatile halide is produced, purified, and decomposed.' In the present case, this concept was used to remove the impurities rather than to form possible volatile copper halides. The object was to produce volatile halides of the impurities present and distill these away, leaving high-purity copper. It is interesting to note that such techniques are used in spectrographic procedures in order to shorten exposure time and enhance the density of impurity lines.' In the present investigation, copper hydroxy fluoride was used, since the temperature of decomposition of copper hydroxy fluoride and the melting point of copper nearly coincide. The fluorine released by the thermal decomposition of copper hydroxy fluoride purges the molten copper. Copper hydroxy fluoride was prepared by dissolving high-purity copper in nitric acid and adding hydrofluoric acid and ammonium hydroxide in the required proportions. The melt was made in a high-purity graphite crucible heated by an induction furnace. Trial experiments showed that impurities can be introduced from the crucible material. Therefore, preceding each cast, the crucible itself was cleaned by decomposing copper hydroxy fluoride and discarding the residual copper. Best experimental conditions were obtained by adding 30 g of copper hydroxy fluoride to 500 g of nor-