Outokumpu Blister Flash Smelting Processes

Copper smelting to form blister in one single step has been possible for a long time even from low grade concentrates. In spite of obvious benefits, it has been economically viable only with few special raw materials having high enough Cu/Fe and Cu/S ratio. Outokumpu Blister Flash Smelting is currently applied at three operations, and three others will be commissioned in the near future. With typical chalcopyrite concentrates two main obstacles have prevented wider adaptation of direct blister processing: slag formation and heat generation. Oxygen potential in the reaction shaft must be high in order to produce blister with targeted sulfur content below 1%. When large amount of iron is oxidized, as well as sulfur, copper is inevitably also oxidized into slag. High copper amount in substantial tonnages of slag lead on to costly down stream recovery operations to obtain discardable slag. Almost complete oxidation of sulfur and iron releases a high amount of heat which traditionally has been solved by lowering oxygen enrichment of the blast leading on to oversized off-gas line and acid plant. One challenge in direct blister smelting relates to the attack of aggressive high-copper containing slag against furnace refractory lining. In continuously operated Outokumpu Direct Blister Flash Smelting this is taken care of by preventing vigorous melt movement in the settler. Stable bath conditions and stationary slag against refractory lining enable the formation of a protective autogenous layer between aggressive slag and vulnerable refractory. These direct blister smelting challenges are addressed from equipment and process development point of view. New solutions to overcome the obstacles are presented and discussed.