Nucleation and Growth of Copper on Stainless Steel Cathode Blanks in Electrorefining

"The deposition of copper on inert substrate depends on the number of active sites that will react at certain overpotential. The critical overpotential depends on surface morphology, surface film resistance and additives on cathode surface. The effects of surface properties on copper nucleation and growth rates were studied for used stainless steel blanks from several tankhouses. The surfaces of the blanks were characterized with electrochemical and mechanical methods. Electrochemical deposition tests were done at current density of 300 A/m2 for 10, 30 and 60 seconds. The nucleation density and copper coverage were estimated using image analysis. The surface film resistance did not correlate with copper growth. Increasing surface roughness correlated with lower copper growth.IntroductionStainless steel cathode blanks in copper electrorefming are usually made of AISI 3 I6L type steel. They have a typical lifetime over 10 years. During use the surface will collect deposits and become rough due to wear and corrosion. These factors can affect the nucleation and growth of copper. The nucleation and deposition of copper on inert substrate depends on the number of active sites that will react at certain overpotential. The critical overpotential can depend on surface film resistance, surface morphology, and additives adsorbed on cathode surface.The deposition potential of metallic ions on a foreign substrate is usually higher than the deposition potential on the electrode made of the same metal due to crystallographic substrate/metal misfit [I]. If the substrate has traces of the depositing metal they will be preferential growth sites. For a smooth deposit a large number of simultaneous nuclei is necessary. However, excessive nucleation density can lead to porous deposits [2]. Surface films of good conductivity are needed for dense nucleation and small nuclei. On cathode blanks the number of active sites increases with increasing surface film conductivity [3-5] and/or surface film porosity [6]. On AISI 3 I6 L stainless steel a more resistive oxide has been found to limit favourable sites for copper nucleation and more conductive film promoted high-density copper nucleation [7]. Also Urda-Kiel et al. have concluded that thicker oxide layers on AISI 304 stainless steel resulted in lower nucleation [8]. Increase in overpotential or current density activates more and more of the potential nucleation sites and this can be seen as higher number of nuclei [9] or smaller average distance between nuclei [10]."