Monitoring The Influence Of Additives On Deposit Morphology During Copper Electrorefining Using Electrochemical Noise Technique

The copper electrodeposition from sulphuric acid electrolytes in the presence of Thiourea and Gelatin as additives was investigated by electrochemical noise and cyclic voltammetry in conjunction with the scanning electron microscopy technique. This study was oriented to examine the utility of using electrochemical noise "EN" technique to characterize the electrowinning process and the deposit structure morphology as compared to cyclic cyclovoltammetry "CV", an electrochemical method generally used industrially. Both EN and CV techniques were successful to reveal the effect of different concentrations of Thiourea and Gelatin on copper electrodeposition process. In this study, CV has detected an excess of Thiourea leading to porous deposit. While, the electrochemical noise analysis in the time domain (skewness and kurtosis parameters) as detected the presence of nodules and has given useful information concerning the morphology of the deposit closely related to the macroscopic and microscopic studies.