Mitigation of Plating Residue through Control of Anode Pitting During Nickel Electrodeposition

"The electrodissolution of nickel pellets with different controlled electrical variables was investigated in an effort to mitigate plating residue in Watts bath based electroplating cells. During galvanostatic dissolution at 0.4 A dm-2, the anode potential was seen to oscillate between passive and pitting potentials. In-situ microscopy and ex-situ characterization has shown that lacy-pit formation and large, partially perforated, pit covers form during the potential decay from pitting potentials. In general, covered pitting at low current density shows increased plating residue. Using potential pulses is one way to maintain greater control over surface pitting by creating a higher density of pit nuclei while at the same time controlling their growth. Pits generated from a series potential pulses were examined ex situ for a range of pulse times and stages of pit growth were identified. An alternative method of anode dissolution was devised using potential pulses and duty cycles that allowed average current densities comparable to industrial plating conditions to be achieved. By restricting the time at pitting potentials to 0.05 s, plating residue was reduced more than six-fold in comparison to an equivalent galvanostatic experiment run at a comparable current density.INTRODUCTIONIn typical galvanostatic (direct current) nickel electroplating cells employing soluble anodes, some amount of plating residue is produced which consists of metallic nickel and impurities that detach from the bulk in the form of small fines. Significant buildup of residue requires plating operations be halted and the anode assembly cleaned of residue before operation can resume. While variables in the refining process have been shown to affect plating residue, more precise control of electrochemical variables may provide an attractive route to mitigation of residue."