Integrating Computational Mechanics and Numerical Optimization for the Design of Material Properties in Electronic Packages

"Silicon components containing transistor circuitry are at the heart of electronic products such as computers, mobile phones, etc. These components are connected to printed circuit boards (PCB's) using solder material that acts as the conductor for both electricity and heat. During the lifetime of a product it will undergo many thermal cycles where the chip becomes hot during product operation and then cools when the product is switched off. At the product design stage engineers undertake thermo-mechanical simulations to predict the thermal stress in the solder joints due to this thermal cycle and to ensure that the stress magnitude will not result in early fatigue-type failure. The design engineer's aim is to identify component parameters which ensure that the solder will survive beyond a certain number of thermal cycles.The aim of integrating computational mechanics and optimization tools together is to speed up dramatically the design process. From viewpoint of a design engineer in the electronics manufacturing sector, these tools can be used to quickly estimate key design parameters (i.e. material properties, product dimensions, etc) that will guarantee the required product performance. In this paper a modeling approach coupling computational mechanics techniques with numerical optimization is presented and demonstrated. The integrated modeling framework is obtained by coupling the multi-physics framework - PHYSICA - with the design optimisation tool- VisuaLDOC. Thermo-mechanical simulations are presented that predict the creep strains in solder material. Different numerical optimization procedures: Direct and Response Surface based optimization plus Design of Experiments, are tested as a part of this modeling framework."