Institute of Metals Division - Strain Hardening of Ordered Cu 3 Au Alloy

Measurements of the 103 yield stress of ordered and disordered poly crystalline Cu ,Au were related to the ordered antiphase domain size determined by resistivity measurements. For undeformed material, a yield stress maximum wa obtained at a critical domain diameter of about 40A. Plastic deformation resulted in a marked increase in the yield stress and electrical resistivity of the ordered alloy compared to the disordered, the strain hardening rate increasing regularly with initial antiphase domain size. Order hardening was accompanied by a sharp reduction in size of the initially large domains. It has been observed that the yield stress of ordered and partially ordered Cu3Au alloy varies sensitively with antiphase domain size aid degree of order.ly2 In addition, ordering of the lattice leads to a marked increase in the strain hardening rate (order hardening) as compared to the rate for the disordered alloy. In the present investigation, changes in the electrical resistivity and yield stress of ordered polycrystalline Cudu with varying initial domain diameters were measured after tensile plastic deformation in order to examine the effect of cold work on the antiphase domain size. EXPERIMENTAL PROCEDURE Au-Cu alloy of 99.99 pct purity analyzing 50.85 wt pct Au-balance copper was obtained from the Handy-Harmon Co., N. Y., in the form of 0.061 in. diam drawn wire. Wire specimens 3 in. in length were given the following annealing treatment in nitrogen: 500" for 72 hr, 820" for 15 hr, and 450" for 5 hr, followed by a water quench. The annealing sequence resulted in a completely disordered structure with a grain size of about 0.2 mm. The disordered specimens were then reannealed at 360' in nitrogen for periods varying from 10 min to 150 hr followed by quenching to produce ordered structures with varying domain sizes. The degree of ordering and variation of domain size was followed by electrical resistivity measurements made at room temperature using a low resistance precision Kelvin double bridge apparatus. The specimen resistance was determined over a length of 4.0 cm between two brass knife-edge contacts while the specimen was immersed in an oil bath to minimize temperature variations. In addition, the current flow in the circuit was minimized by a current pulse technique in balancing the bridge in order to avoid heating the specimen. Using a sensitive galvanometer to detect the bridge null, the accuracy of the resistance measurement Wire specimens were plastically strained in tension with an Instron tensile unit at strain rates in the range 5 x 10"5 sec-' to 2 x 10"4 sec-'. Stress and extension data were fed into the Instron chart drive amplifier to obtain the actual stress-elongation curve from which the yield stress at 10"3 strain was determined. The maximum resolution of the apparatus was approximately 50 psi stress and 3 x 104 strain. At various plastic strain levels, deformation was interrupted and the electrical resistivity determined after removing the stress. RESULTS AND DISCUSSION 1) Yield Strength of Ordered Cudu. In order to determine the effect of the ordered antiphase domains on the initial yield stress, specimens were prepared with varying domain sizes ranging from zero for 5 completely disordered structure to about lo5A for a completely ordered structure by suitable annealing treatment. Domain sizes were estimated by comparing room temperature electrical resistivity data with the original data of Jones and sykes3 as modified by rdle.' In agreement with previous work, the resistivity varied sensitively with domain diameter and degree of order, decreasing from approximately 11.6 x l0- ohm-cm for the disordered structure to about 5.9 x l0- ohm-cm for ordered domains above 10"3 cm in diameter. Fig. 1 shows the change of the 103 yield stress with ordered domain size. It is evident that the maximum