Institute of Metals Division - Solid State Bonding of Aluminum to Nickel (Discussion page 1330)

The solid state bonding of aluminum to nickel was studied as a function of temperature, pressure, and time at pressure. The initial results indicated that as the reaction conditions were varied, marked changes in tensile strength occurred. Plots of the log penetration coefficient vs the reciprocal of absolute temperature for various isobars were straight lines displaced from each other. THE techniques of bonding different metals to A each other include brazing, welding, welding by application of a molten phase, and solid state welding without any molten phase present. This last technique, the pressing of metals either at room temperature or at some temperature below the melting point of the metals to be joined, seems to offer interesting possibilities for bonding purposes. However, this technique has not been completely investigated, and very little is known about the diffusion phenomena which occur during solid state welding. Some previous work on the effect of pressure on diffusion1 was inconclusive. This paper is concerned with an investigation regarding the effect that the processing variables, such as pressure, temperature, and time at pressure, have in solid state bonding. The tests were made with aluminum and nickel and special emphasis was given to the strength of the bond between these two metals and to the intermetallic penetration rate during the bonding process. It seems that the effect of pressure on the intermetallic penetration is of particular importance for practical purposes and this effect was therefore studied in detail. Procedure Apparatus: The means of solid state bonding used for this study was that of the hot-pressing technique. This method requires the equipment pictured in Fig. 1 and involved the following procedure. The two metals to be bonded were placed in an aquadag lubricated 18-4-1 tool steel die, 16 in. high by 1.440 in. ID, between punches of 1.366 in. diameter made of the same material. A thermocouple