Institute of Metals Division - Solid Solution Strengthening in Alpha Cu-Al Single Crystals

The critical resolved shear stress of aCu-A1 single crystals has been investigated as a function of composition, testing temperature, and strain rate. The strength, and its temperature and strain rate dependency increase markedly with aluminum content. The solid solution strengthening at 4.2°K is much larger than at room temperature. The activation energy for the low temperature dislocation cutting process increases from about 0.17 ev for a 0.5 at. pct A1 alloy to about 0.50 ev for a 14 at. pct A1 alloy. This result is attributed to an increase in the width of extended dislocations due to the known decrease in the stacking fault energy. In addition, the activation volumes at 4.2 and 77°K decrease with aluminum additions. Concerning the solid solution strengthening in the 296° to 373°K range, no definite conclusions are reached, but it is suggested that subgrains and cutting of subgrains are important. In a previous paper,' the authors reported that adding aluminum to copper produces two types of strengthening: a yield point effect and an increase in the lower yield stress. This behavior is illustrated in Fig. 1 by shear stress-shear strain curves of furnace-cooled single crystals of pure copper and Cu-14 at. pct A1. The yield point effect, At, was thoroughly studied previously1 and shown to be associated with short-range order. The present paper reports an investigation of the lower-yield stress in aCu-A1 single crystals as a function of composition, testing temperature, and strain rate. EXPERIMENTAL PROCEDURE Single cryski1 tensile specimens were prepared in the same manner as previously described.l Briefly,