Institute of Metals Division - Growth Substructure in Rapidly Solidified Zn-2 Pct Au Alloys (TN)

WHEN impure Zn (< 99.99 pct)&apos;&apos;Z or Zn-Cd alloys3 are progressively solidified, a cell or "corrugation" substructure4 is produced in the solid, with a high impurity or solute concentration along the cell walls. When these materials are polished and suitably etched, etch pits are often observed along the cell walls. For the Zn-Cd alloys these etch pits have been associated with decorated dislocations, present in the corrugation boundaries to accommodate the lattice strain. In the course of an investigation of Zn-2 pct Au alloy, molten metal of this alloy was poured into cold water and the resultant solid pieces were sectioned, polished and etched with a Cr0 ethant. An extremely regular cell pattern was observed on the etched surface, similar in general to the corrugation structure previously reported for impure zinc and Zn-Cd alloys. At higher magnification, regularly spaced pits were observed along the cell boundaries. An example of the regular cell pattern at the center of a specimen is shown in the center and lower portions of Fig. 1; the top of the figure shows the pattern near the specimen surface. Typical etch pits in the cell walls are shown in Fig. 2. It was surprising that a cell pattern as regular as that shown in the center of Fig. 1 was produced at the very rapid solidification rates used (estimated as > 1 cm per sec). In addition, the distribution coefficient for the Zn-Au system is greater than 1. Accordingly, the center of the cells should be rich in solute and should etch