Institute of Metals Convenes

THE Institute of Metals Division opened its series of meetings by a session* on lead, R. S. Dean be-ing in the chair and G. 0. Hiers acting as vice-chairman. A large and representative audience listened to the papers in the abstract and contributed an inter-esting and fruitful discussion. The main points of these papers and discussion are given below: In the absence of Carl E. Swartz, the summary and conclusions of his paper, "A Study of the Lead-Tin-Cadmium System with Reference to Their Use as Solders," were read. Swartz investigated a number of alloys in the lead-tin-cadmium system and prepared a diagram representing the solidification ranges of these alloys. He also made tensile strength tests of joints made with these alloys, and compared these with joints made with ordinary lead-tin solder. The tests showed solders containing cadmium were equally strong as the lead-tin series and that the cadmium alloys were suit-able in other respects for use as solders. In general, solders of the composition near to the ternary lead-tin-cadmium eutectic appeared to be the best for most soldering work although compositions widely differing are desirable for special purposes. The lead-tin-cad-mium solders are finding a market particularly in the fields requiring lower solidification temperatures than common solders. Mr. Darby opened the discussion and asked whether it was a fact that the lead-tin-cadmium solders were more useful than ordinary solders on galvanized and tin-plated sheet. C. Smith said he thought it to be a fact that galvanized sheet was more easily soldered by the lead-tin-cadmium solders than common lead-tin-solder. Continuing, Mr. Smith showed lantern slides of his own investigation of the thermal diagram and recommended the 70 per cent lead, 20 per cent cadmium, and 10 per cent tin for general employment. He thought the author did not differentiate between wetting and alloying and pointed out that wetting was more a ques-tion of the flux than the metal. In some cases a definite alloy was formed by soldering and in some no evidences of alloying were found. Illustrating the former case he showed slides and demonstrated that failures always took place longitudinal with the brittle compound alloy and transversely across the solder itself.