Improved Mems Thermal Actuator Design by Modification of Hot-Arm Geometry

"We present an improved design for the two-arm polysilicon thermal actuator. The classic thermal actuator design produces a localized hot spot at approximately the center of the thin actuator arm. This phenomenon limits the actuator efficiency, lifetime, and reliability. Since the actuator deflection is based on thermal expansion of the material, advantage may be gained by making the temperature profile more uniform along the hot-arm length. In our design, the geometry of the thin arm is modified by forming a nonlinear structure near the approximate location of the original hot spot. Electromechanical simulations of this design show an increase in deflection, due to a flattening of the temperature profile along the hot arm. The solid model generation, finite element analysis and simulations are carried out using PEA software. Experimental devices are in the process of being fabricated by using a polysilicon rnicromachining process.1. IntroductionMost active MEMS devices employ some kind of actuating mechanism to increase functionality. Various actuating mechanisms like magnetic, electrostatic, thermal, magnetostatic and piezoelectric have been investigated and incorporated for actuating microstructures. The primary features required from many on-chip actuating mechanisms are large deflection (>10 µm), low actuation voltage, low power.consumption, reliability, fast response, ease of design and fabrication, and small size. Thermal actuation is an attractive mechanism for rnicromechanical devices requiring high actuation forces, large deflections, good linearity and low actuation voltage. Thermal actuators, also known as ""electrothermal actuators"", ""heatuators"" or ""U-shaped thermal actuators"", have been largely used in MEMS based devices to provide both in-plane and out-of-plane actuation [l] .Thermal actuators are also easily compatible with standard CMOS circuitry due to their low driving voltage. However, high power consumption remains a major drawback of the thermal actuation mechanism."