Guar Concentration Measurement With The CollaMat System

In recent years the CollaMat process has been used successfully worldwide in a number of copper electrorefining tankhouses as an instrument for measuring the glue concentration and optimizing cathode quality. Owing to its measuring principles the CollaMat can be used not just for measuring the concentration of active glue but also the activity of other substances, which have an impact similar to glue on the copper deposition. In SX-EW plants guar is frequently used instead of glue as a levelling additive. In our laboratory the effect (activity) and the decomposition rate of guar in copper electrolyte was examined. As expected, the results show that guar has an effect similar to glue on the copper deposition. However, at the same temperature, a greater quantity of guar is required to achieve the same results. As with glue, the decomposition rate (due to hydrolysis) of guar is strongly dependent on the temperature. Therefore, in practice, its on-line monitoring is necessary to guarantee the same guar activity at any time.