Examination of Copper Electrowinning Smoothing Agents. Part II: Fundamental Electrochemical Examination of DXG-F7 9

"Cyclic voltammetry, electrochemical impedance spectroscopy (EIS), and galvanodynamic and chronopotentiometric techniques were used to characterize the effects of DXG-F7®, a commercial smoothing agent, on copper electrodeposition onto 316L stainless steel from a synthetic electrolyte containing 40 g/L copper (Cu2+), 160 g/L sulfuric acid (H2SO4) and 20 mg/L chloride (Cl-) at 40oC. The findings were compared against results using HydroStar® 4208, a modified polysaccharide. The nucleation overpotential and plating potential observed in cyclic voltammetry and galvanodynamic testing showed that neither DXG-F7 nor HydroStar significantly polarized acidic copper electrodeposition. Subtle differences between the additives were found during EIS testing and modeling, but more research will be needed to fully understand these differences. Surface-roughness measurements of two-hour deposits indicate that DXG-F7 and HydroStar produced smoother deposits as their concentrations in the electrolyte increased. No difference in the surface roughness of deposits was detected between the additives. Based on the experimental evidence resulting from the laboratory testing, no significant difference was found between DXG-F7 and HydroStar at 20 mg/L Cl- concentration, with the exception that DXG-F7 dissolves more easily in water than HydroStar. Introduction Cathode deposits obtained from acidified copper sulfate electrolyte(s) without organic additives are often soft, coarsely crystalline and nodular (Sun and O’Keefe, 1992). Therefore, small amounts of organic additives are added to the electrolyte to produce level and dense cathodes during copper electrowinning. The action of organic additives is thought to be due to their adsorption on the surfaces of the newly formed copper grains. Hence, any copper grain that grows excessively fast adsorbs a layer of organic additive, which inhibits growth. The result is a smoother and harder deposit of suitable purity (Sun and O’Keefe, 1992). In part I of our four-part series on the examining of copper electrowinning smoothing agents, a review of previously published work on organic additives used during copper electrowinning was presented (Moats, Luyima and Cui, 2016). In the review, it was noted that many tankhouses had switched from guar to other saccharide-based products such as HydroStar and DXG-F7."