Effects of La Addition on the Microstructure and Mechanical Properties of Sn-58bi Solders Joints with OSP Pads

"Rapid whisker growth was significantly alleviated in a Sn-58Bi alloy doped with 0.5 wt.% La. Experimental results showed that many thin, plate-form intermetallic phases appeared in the solder matrix. The absence of tin whiskers was correlated to the shape effect of RE-containing intermetallic plates. After reflowing, Cu6Sn5 intermetallic compounds appeared at the solder/pad interfaces of Sn-58Bi and Sn-58Bi- 0.5La packages with OSP pads, which grow linearly during the aging at 75 and 100? for various times ranging from 100 to 1000 h. In addition, the interfacial intermetallics layers in Sn-58Bi-0.5La solder joints were also observed thinner than those in undoped Sn-58Bi joints. However, RE-containing interfacial intermetallic compounds in Sn-58Bi-0.5La solder joints led to lower bonding strengths in both ball shear tests (0.4 mm/s) and high speed ball shear tests (2000 mm/s). All the reflowed and aged solder joints of both packages were ruptured through the solder balls indicating brittle characteristic INTRODUCTIONIt has been widely reported that solder alloys doped with rare earth (RE) elements reveal many beneficial effects, such as higher strength, lower melting point, improved wettability, and longer creep life (Wu et al., 2004; Ma et al., 2002; Chen et al., 2002). In addition, Dudek et al. reported that the alloying with 0.5 wt.% La in Sn-3.8Ag-0.7Cu solders resulted in an increase of rupture strain, up to 150% over undoped solders (Dudek et al., 2006). However, Chuang and Yen observed that a large amount of long, fiber-shaped tin whiskers were extruded out of the oxidized CeSn3 intermetallic clusters in the matrix of a Sn-3Ag-0.5Cu-0.5Ce solder air-stored at room temperature for several days (Chuang & Yen, 2006). Furthermore, many coarse hillocks appeared around the CeSn3 clusters in the RE-doped alloy after storage in an air furnace at 150? for several minutes. Chuang proposed a mechanism for the phenomenon of rapid whisker growth, which the predominate oxidation of CeSn3 intermetallics in Sn-3Ag-0.5Cu-0.5Ce solders induced compressive stress and extruded the tin atoms out of the specimen in the form of tin whiskers (Chuang, 2007). However, further investigation showed that Sn-9Zn-0.5Ce solders, after long term exposure at room temperature and 150?, were immune to the whisker growth; the immunity was attributed to the refining of the CeSn3 intermetallic phase in the alloy (Chuang & Lin, 2008). The inhibition of tin whiskers through the refining of rare earth containing intermetallics was further observed in Sn-3Ag- 0.5Cu-0.5Ce solders doped with 0.5 wt. Zn (Chuang & Lin, 2009). In addition to the size effect, the thin plate shape of intermetallic compounds was also shown in this study to inhibit the whisker growth on the surface of Sn-58Bi-0.5La solders."