Effect of Flux Coating on Interfacial Microstructure in Bimetallic Al7simg/Cu Compound Castings

"Compound casting is a very attractive approach to reduce the weight of components for some specific applications while keep both the functional and the mechanical property requirements. In this work, Al-7Si-Mg alloy /copper compound castings were produced through a low pressure die casting process. To reduce the oxide present in the interface, flux coating of the copper pipes was tested. The interface layer formed between the two alloys was investigated using Optical Microscopy (OM), Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS). Vickers Micro-hardness was also measured across the interface. Results showed that the flux coating prevented the formation of the metallic bond between copper and aluminum. Instead, high concentrations of potassium, magnesium and fluoride, coinciding with formation of KMgF3 and MgF2, were detected in the interface. In the castings without surface treatment, a continuous metallurgical bond was achieved. In the bond layer, various Al-Cu intermetallic phases have been detected. In addition, formation of primary silicon particles in the reaction layer was observed in all castings. The mechanism for the formation of the intermetallic phases and the strength of the interface layer have been discussed.INTRODUCTION Recent development in the automotive industry has focused on producing lightweight components, which can reduce CO2 emission and increase the efficiency. Often, one material alone is not able to meet the requirements for a specific use. The need for lightweight bimetallic components has therefore increased. Aluminum-copper bimetallic components can be used in wires and bus bars where conductivity is an important factor (Lee, Bang, & Jung, 2005). Compared to Al-Cu alloys, Al-Cu bimetallic components can reduce both weight and cost without reducing electrical and thermal conductivity (Sheng, Yang, Xi, Lai, & Ye, 2011). A challenge is, however, that aluminum and copper have high affinity to each other, especially at elevated temperatures. This causes formation of brittle intermetallic phases with high electric resistance (Liu, Wang, Sui, Wang, & Wenjiang, 2016). In addition, both metals are subjected to oxide formation on the surface. Copper is especially exposed to oxidation at elevated temperatures (Pinnel, Tompkins, & Heath, 1979), while a thermodynamically stable oxide layer will spontaneously form on the aluminum surface (Papis, Loeffler, & Uggowitzer, 2009). Oxides are known to be passive substrates, which will reduce wettability and will thus prevent the formation of metallic bonding between aluminum and copper (Papis, Hallstedt, Löffler, & Uggowitzer, 2008)."