Dynamic wetting spread factors and interfacial heat transfer coefficients in the solidification of aluminum droplets on copper substrates

Dynamic wetting spread factors and interfacial heat transfer coefficients were determined for aluminum droplets solidifying on copper substrates, The spread factors were determined from the droplet geometries while the heat transfer coefficients were obtained by solving inverse heat conduction problems, 1-D and 2-D heat transfer models are presented and the results they provided are compared, For the latter, a sensitivity analysis was also performed to determine the influence of thermophysical properties and boundary conditions. Experiments were alternatively carried out with three different gaseous atmospheres and the dynamic wetting spread factors were correlated to the interfacial heat transfer coefficients.