Development of Roughness in Electrodeposited Ultrathin Ni Films

The Minerals, Metals and Materials Society
B. Dou K. C. Liddell
Organization:
The Minerals, Metals and Materials Society
Pages:
7
File Size:
157 KB
Publication Date:
Jan 1, 1998

Abstract

"In producing multilayer films for magnetic data storage applications, the interfacial roughness must be controlled in order to obtain high quality materials with reproducible properties. The present understanding of the effect of roughness on multilayer properties such as magnetoresistance is sketchy, particularly for electrodeposited films. In this study, quantitative atomic force microscopy was used to characterize surface morphology before and after Ni films of varying thickness were deposited on Cu cathodes. A multinuclear multilayer growth mechanism is supported by both the deposition conditions and the AFM images, and a multinuclear multilayer model gave a satisfactory fit to measurements of the density of peaks on ultrathin Ni films between 0 and 8 nm thick.Alloys consisting of alternating ferro-and paramagnetic layers have begun to replace Permalloy in the sensing elements of magnetic hard drives. The operating principle of the new read heads is giant magnetoresistance (GMR), and they are smaller and more sensitive than previous inductive heads (1). Experimental studies on sputtered multilayers have emphasized the role of layer thickness and interlayer roughness in determining the presence and size of the GMR effect (e.g., 2,3,4,5,6). However, roughness in electrodeposited multilayers has rarely been measured, even though read heads are likely to continue to be made by this process for some time to come. Cu/Ni can be considered a model system for understanding processing-microstructure-property relationships in electrodeposited multilayers and is the most widely investigated of all such systems (e.g., 7,8,9,10,11,12). Nevertheless, the roughness of the interfaces in Cu/Ni electrodeposits has not been systematically characterized by quantitative techniques, and in all studies reported so far, the total deposit thicknesses were considerably greater than the 10 nm needed for most sensor applications (1). The thinnest such films were about 50 nm (7)."
Citation

APA: B. Dou K. C. Liddell  (1998)  Development of Roughness in Electrodeposited Ultrathin Ni Films

MLA: B. Dou K. C. Liddell Development of Roughness in Electrodeposited Ultrathin Ni Films. The Minerals, Metals and Materials Society, 1998.

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