Application of Coupled Continuum-Mesoscopic Computational Methods for the Simulation of Complex Fluids in Industrial Processes

"Recent advances in new computational modelling techniques such as Lattice-Boltzmann and Dissipative Particle methods offer the prospect of simulating complex fluids such as colloidal and dense suspensions in industrial processes. They are referred to as mesoscopic methods since they lie between molecular dynamics at a microscopic atomistic scale «lO-9m) and traditional macroscopic CFD methods (> 1O-2m). The models behave like a 'coarse-grained' gas consisting of fictitious interacting particles, which are much larger than the real molecules of the actual fluid they represent. Inter-particle forces are set so that the collisions collectively mimic the phenomenological transport properties and flow of the underlying fluid at a macroscopic scale.Much of the developmental work to date has focused on laying theoretical foundations based on thermodynamic and kinetic theory. Successful applications include predictions of macroscopic transport properties of complex fluids and flows in porous media and filters. With the constant increase in computational power, these mesoscopic methods are now sufficiently developed to determine their suitability to simulate complex fluid flows in real industrial processes. This work describes the application of meso scopic methods to the stencil printing of solder pastes in the assembly of electronic components. The aim of this work is to assess the ability of these methods to study the transport mechanisms of individual solder particles suspended in the flux solvent as they enter and fill the micro-apertures of a stencil. This paper demonstrates the coupling of such mesoscopic methods to continuum CFD methods to predict the flow of dense suspensions (i.e. solder paste) in industrial processes."