Annealing Effect and Tensile Interface Fracture Mechanism of Pure Silver Bonding Wires

"Since Ag wires have similar hardness and bonding properties to Au wires, they can be applied in some pads. In the present study, the annealing effect (at 225°C~275°C for 30min) on the tensile mechanical properties of silver wires with f=23µm was investigated. In addition, the micro-structural characteristics and the mechanical properties before and after an electric flame-off (EFO) process were also studied. Experimental results indicate that with annealing temperatures of more than 250°C, the silver wires possessed a fully annealed structure, the tensile strength and the hardness decreased, and the elongation was raised significantly. Under the thermal effect of EFO, the necks of the Ag balls underwent recrystallization and grain growth was induced, and the annealed Ag wires had a shorter zone of HAZ (220µm). The bonding strength and the neck-strength of the Ag wires were more than 7gf and possessed excellent bonding properties.IntroductionThermosonic ball bonding is one of the preferred processes for electronic packaging to connect a semiconductor chip and a lead frame by a thin metal wire. At present, gold wire and copper wire are the preferred interconnect materials to bond with the aluminum metallized wafer pads [1, 2]. Since gold is expensive and the reliability of copper is poorer [3], the study of silver wire has attracted a lot of attention already. In addition, the inherent properties of high ductility and low hardness of silver as well as its workability effectiveness compared to gold, have made it a preferred alternative .[4, 5]"