An Electrochemical and SERS Study of the Gold-Thiosulfate Interface in the Presence of Copper

Gold passivation in thiosulfate leaching media is a major barrier to its implementation. Addition of Cu (II) into the leaching solution has shown to aid in gold dissolution, but the mechanism by which it acts, and its role in the passive layer, remains unknown. Surface Enhanced Raman Spectroscopy (SERS), in tandem with linear sweep voltammetry, were employed to determine the dependence of leaching currents on mass transport and for fingerprint identification of sulfur species on the surface of gold. SERS leaching experiments were performed using gold nanorod electrodes that showed increased stability compared to other SERS active surfaces.