A Novel High Thermal Conductivity Al-Si Casting Alloy and Application

A novel eutectic-type alloy Al12Si-HTC with high thermal conductivity has been developed by strict chemical composition control and heat treatment. The thermal conductivity of the alloy is about 30 % higher than that of current commercial Al12Si alloy. The Al12Si-HTC alloy has a silicon content of 10~12 wt.%, which provides excellent castability. Trace element strontium or calcium is added to modify eutectic silicon, and contents of transition elements such as copper, manganese are controlled in a low level. By appropriate heat treatment, thermal conductivity of the castings increases by 7.5 % and finally reaches 172 W/(m·K). It is found that eutectic silicon modification which makes average particle size finer than 2µm plays a dominant role in improving thermal conductivity, as well as further spheroidization of eutectic silicon and reduction of lattice defects in a-Al microstructure in subsequent heat treatment process. The alloy is successfully applied to produce a certain communication enclosure with complex finned structure by die casting process in industrial scale. The results of numerical simulation and thermal analysis experiments show that when manufactured by Al12Si-HTC alloy, the surface temperature of chips in the enclosure is reduced by 2.0~4.5 ? and the temperature distribution is more homogeneous compared with traditional Al12Si alloy.