A Mineralogical Study Of Nodulated Copper Cathodes

Mineralogical studies were carried out on nodulated copper cathodes from three primary refineries to characterize the nodular growths and to elucidate the causes of the nodulation. Nodulation is often initiated at the surface of the starter sheet or the stainless steel plating blank, although a layer of smooth copper sometimes is deposited before nodulation commences. In some instances, the "roots" of the nodules exhibit a pronounced dendritic texture that is associated with an abundance of cavities. Slimes particles are not usually associated with these growth features which lead to a globular surface deposit. The globules sometimes develop into larger nodules, and this type of nodulation is likely caused by improper addition agent concentrations. The nodules on most cathodes, however, exhibit "roots" at the contact with the substrate that are associated with microcavities and large clusters (>40 µm) of slimes particles. The slimes constituents are commonly Ag powder, PbSO4 and Cu2(Se,Te) but not AgCu(Se,Te) or Ag,(Se,Te). The size of the slimes clusters, rather than their composition, appears to be the important factor causing the copper to grow into nodules. Tiny individual slimes particles themselves do not appear to cause cathode nodulation.