"Recovery of Copper from Effluents by Supported Liquid ION Exchange Membranes – From Laboratory Scale to an IntegratedPilot Plant"

In this paper, results are presented concerning the search to implement Supported Liquid Membrane (SLM) technology for the recovery of copper from electroplating effluents. Acid copper electroplating rinse solutions or effluents resulting from the post-treatment of, for example, cyanide-containing copper electroplating baths all contain copper (2+) in the lower concentration levels. A thorough study of the influence of the individual parameters and of their combined impact on mass transfer in small scale laboratory SLM modules has been performed, enabling to set forward the appropriate operating conditions for a pilot plant installation. The pilot plant, containing two SLM modules. of 18 m2 of surface area, has been tested extensively, including short and long term runs, with real process solutions. It was demonstrated that this installation is able to treat 40 l/h of acid copper sulphate rinse solutions· containing 500 ppm of copper. The final copper concentration in the effluent can be reduced to a few ppm while copper metal is recovered by electrolysis of the concentrate. This technology is also applicable to the treatment of solutions with low copper content of origins other than plating shops, such as tailings from copper plants or mine waters.